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商品の詳細:
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| 色: | 透明な黒 | 粘度 (25°C): | 6000±1000mPa・s |
|---|---|---|---|
| 硬化条件: | 600mJ/cm2(LED UV) | 硬度: | 岸 D 40 |
| ガラス転移温度 (Tg): | 10°C | 絶縁耐力: | 20KV/mm |
| 貯蔵寿命: | 12ヶ月（8～28℃） | 包装: | 50g/1kg |
| 応用: | BGA チップの補強、コンポーネント底部の固定 | ||
| ハイライト: | UV curable adhesive for BGA chips,Fast curing UV adhesive high adhesion,UV cure adhesive component bottom fixation |
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Fast Curing UV Curable Adhesive Fast Curing UV Curable Adhesive is a transparent black, LED-curable adhesive specially formulated for BGA chip stiffening and component bottom fixation. It offers high adhesion with excellent flexibility, low shrinkage and low dielectric constant, high thixotropy with good color visibility for easy dispensing, and LED 3-5 second fast curing, delivering reliable stiffening and protection for sensitive electronic components. Key Features Fast
コンタクトパーソン: Eric Hu
電話番号: 0086-13510152819
Japanese
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